TY - GEN
T1 - A new air cleaning and cooling instrument using oblique honeycomb
AU - Minobe, S.
AU - Terada, I.
AU - Motoyoshi, Y.
AU - Hanaoka, H.
AU - Shirai, Y.
AU - Ohmi, T.
PY - 2006/12/1
Y1 - 2006/12/1
N2 - A new instrument with unified fonctions of washing and cooling for the intake air to clean rooms was studied. Its structure is based on oblique honeycombs made of high purity alumina as contact media of air to water. The alumina medium releases less contaminant to pure water than the conventional. The instrument showed high efficiencies in air cooling as well as removal of inorganic chemicals in the air. These resulted in the shortening of their lengths, reducing the amount of recycling water and consequently lowering the pressure loss upon the air treatment. The new instrument can provide very clean environments with low operation costs.
AB - A new instrument with unified fonctions of washing and cooling for the intake air to clean rooms was studied. Its structure is based on oblique honeycombs made of high purity alumina as contact media of air to water. The alumina medium releases less contaminant to pure water than the conventional. The instrument showed high efficiencies in air cooling as well as removal of inorganic chemicals in the air. These resulted in the shortening of their lengths, reducing the amount of recycling water and consequently lowering the pressure loss upon the air treatment. The new instrument can provide very clean environments with low operation costs.
UR - http://www.scopus.com/inward/record.url?scp=50249126661&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50249126661&partnerID=8YFLogxK
U2 - 10.1109/ISSM.2006.4493124
DO - 10.1109/ISSM.2006.4493124
M3 - Conference contribution
AN - SCOPUS:50249126661
SN - 9784990413804
T3 - IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
SP - 417
EP - 420
BT - ISSM 2006 Conference Proceedings - Fifteenth International Symposium on Semiconductor Manufacturing
T2 - ISSM 2006 - 15th International Symposium on Semiconductor Manufacturing
Y2 - 25 September 2007 through 27 September 2007
ER -