TY - GEN
T1 - A nanostructual microwave probe used for atomic force microscope
AU - Ju, Y.
AU - Hamada, M.
AU - Kobayashi, T.
AU - Soyama, H.
PY - 2008
Y1 - 2008
N2 - In order to develop a new structure microwave probe, the fabrication of AFM probe on the GaAs wafer was studied. A waveguide was introduced by evaporating Au film on the top and bottom surfaces of the GaAs AFM probe. A tip having 8 μm high, and curvature radius about 50 nm was formed. The dimensions of the cantilever are 250×30×15 μm. The open structure of the waveguide at the tip of the probe was introduced by using FIB fabrication. AFM topography of a grating sample was measured by using the fabricated GaAs microwave probe. The fabricated probe was found having nanometer scale resolution, and microwave emission was detected successfully at the tip of the probe by approaching Cr-V steel and Au wire samples.
AB - In order to develop a new structure microwave probe, the fabrication of AFM probe on the GaAs wafer was studied. A waveguide was introduced by evaporating Au film on the top and bottom surfaces of the GaAs AFM probe. A tip having 8 μm high, and curvature radius about 50 nm was formed. The dimensions of the cantilever are 250×30×15 μm. The open structure of the waveguide at the tip of the probe was introduced by using FIB fabrication. AFM topography of a grating sample was measured by using the fabricated GaAs microwave probe. The fabricated probe was found having nanometer scale resolution, and microwave emission was detected successfully at the tip of the probe by approaching Cr-V steel and Au wire samples.
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UR - http://www.scopus.com/inward/citedby.url?scp=62249200543&partnerID=8YFLogxK
U2 - 10.1109/DTIP.2008.4752974
DO - 10.1109/DTIP.2008.4752974
M3 - Conference contribution
AN - SCOPUS:62249200543
SN - 9782355000065
T3 - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
SP - 158
EP - 161
BT - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
T2 - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Y2 - 9 April 2008 through 11 April 2008
ER -