A miniature thin-film shielded-loop probe with a flip-chip bonding for magnetic near field measurements

Naoya Tamaki, Norio Masuda, Toshihide Kuriyama, Jin Ching Bu, Masahiro Yamaguchi, Ken Ichi Arai

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

In order to obtain EMC design information, it is important to accurately evaluate the near field of LSI chips and printed circuit boards as well as the interconnect currents. In particular, the need for measurement of LSI, considered as a source of noise, has increased. The authors have developed miniature shielded loop probes by using a thin film process. There is a problem that electromagnetic shielding at the wire bonding junctions for the loop output has not been sufficient. In the present paper, a new miniature shielded loop probe configuration is proposed in which the loop output is extracted by means of flip-chip bonding, which is expected to improve the shielding capability and reduce insertion loss. The effectiveness of the flip-chip bonding is demonstrated by an evaluation of magnetic field detection by the fabricated probe near interconnections.

Original languageEnglish
Pages (from-to)37-45
Number of pages9
JournalElectronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi)
Volume88
Issue number4
DOIs
Publication statusPublished - 2005 Apr 1

Keywords

  • Flip-chip bonding
  • Near magnetic field measurement
  • Shielded loop probe
  • Thin film

ASJC Scopus subject areas

  • Physics and Astronomy(all)
  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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