Abstract
A new microscopy system for characterization of mechanical properties of small-scaled objects is reported. A force sensor, piezo stage, manual manipulators, etc. are integrated in a single platform and these are combined with a high-resolution digital microscope to acquire the load-displacement relationships of the small-scaled objects together with the corresponding deformation pattern of the objects during testing. A small-span bending test of ultrathin Pt wire is demonstrated and the results are discussed.
| Original language | English |
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| Title of host publication | Electronics System Integration Technology Conference, ESTC 2010 - Proceedings |
| DOIs | |
| Publication status | Published - 2010 Dec 1 |
| Event | 3rd Electronics System Integration Technology Conference, ESTC 2010 - Berlin, Germany Duration: 2010 Sep 13 → 2010 Sep 16 |
Publication series
| Name | Electronics System Integration Technology Conference, ESTC 2010 - Proceedings |
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Other
| Other | 3rd Electronics System Integration Technology Conference, ESTC 2010 |
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| Country | Germany |
| City | Berlin |
| Period | 10/9/13 → 10/9/16 |
ASJC Scopus subject areas
- Control and Systems Engineering
- Electrical and Electronic Engineering
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Cite this
Tohmyoh, H., Akanda, M. A. S., & Saka, M. (2010). A microscope system for characterization of mechanical properties of small-scaled objects. In Electronics System Integration Technology Conference, ESTC 2010 - Proceedings [5642853] (Electronics System Integration Technology Conference, ESTC 2010 - Proceedings). https://doi.org/10.1109/ESTC.2010.5642853