A micro thermal switch with a stiffness-enhanced thermal isolation structure

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5 Citations (Scopus)

Abstract

A solid-contact-type thermal switch requires both high contact force and high thermal isolation, but they are in tradeoff relation. This study demonstrated a novel stiffness-enhanced thermal isolation structure, which can generate high contact force but does not increase heat loss. The stiffness of parylene beams is multiplied by that of silicon stiffening beams, which apply rotational constraint to the parylene beams to reduce the equivalent length of the parylene beams. The stiffening beams are designed as they cause no additional heat loss. The silicon stiffening beams increased the stiffness of the parylene beams by a factor of 1.6, and the unnecessary thermal conductance was still as low as 3.7 × 10-5 W K-1.

Original languageEnglish
Article number104008
JournalJournal of Micromechanics and Microengineering
Volume21
Issue number10
DOIs
Publication statusPublished - 2011 Oct

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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