A method for seeking high thermal conductivity compounds

Yoshihiro Terada, Junji Nakata, Tetsuo Mohri, Tomoo Suzuki

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

Thermal conductivity of an intermetallic compound is characterized as an enhancement due to ordering with reference to the basic contribution of solid solutions. A necessary condition of having high thermal conductivity of a given intermetallic compound is, therefore, that the solid solution itself transports high thermal current. A periodic table in helical form for seeking the high conductivity compound is proposed by summarizing the electrical resistivity data of solid solutions. Assessments of thermal conductivity were conducted for the intermetallic compounds based on noble metals. Cu3Au, CuAu and AgMg show the maximum value for 157, 167 and 147 Wm-1 K-1 at ambient temperature among L12, L10 and B2 compounds, respectively.

Original languageEnglish
Pages (from-to)479-485
Number of pages7
JournalIntermetallics
Volume6
Issue number6
DOIs
Publication statusPublished - 1998

Keywords

  • A. intermetallics
  • B. thermal properties
  • Electrical resistance and other electrical properties
  • G. aero-engine components
  • Miscellaneous

ASJC Scopus subject areas

  • Chemistry(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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