A method for nondestructive evaluation of crack depth on metal surface by microwaves

M. Saka, Yang Ju, Daying Luo, H. Abé

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A microwave method to evaluate the depth of cracks on the metal surface is demonstrated. An open-ended coaxial line sensor was developed to improve the spatial resolution for detection of small 3D cracks. The amplitude of the reflection coefficient that is associated with the dimensions of the cracks is measured by scanning the specimen in the direction perpendicular to the detected crack. A characteristic signal corresponding to the detected crack was obtained and was used to evaluate the depth of cracks.

Original languageEnglish
Title of host publication2000 25th International Conference on Infrared and Millimeter Waves - Conference Digest
EditorsShenggang Liu, Xuechu Shen, K. J. Button
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages423-424
Number of pages2
ISBN (Electronic)0780365135, 9780780365131
DOIs
Publication statusPublished - 2000 Jan 1
Event25th International Conference on Infrared and Millimeter Waves, IRMMW 2000 - Beijing, China
Duration: 2000 Sep 122000 Sep 15

Publication series

Name2000 25th International Conference on Infrared and Millimeter Waves - Conference Digest

Other

Other25th International Conference on Infrared and Millimeter Waves, IRMMW 2000
CountryChina
CityBeijing
Period00/9/1200/9/15

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation
  • Radiation

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  • Cite this

    Saka, M., Ju, Y., Luo, D., & Abé, H. (2000). A method for nondestructive evaluation of crack depth on metal surface by microwaves. In S. Liu, X. Shen, & K. J. Button (Eds.), 2000 25th International Conference on Infrared and Millimeter Waves - Conference Digest (pp. 423-424). [893090] (2000 25th International Conference on Infrared and Millimeter Waves - Conference Digest). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICIMW.2000.893090