A matched expansion probe card for high temperature LSI testing

Seong Hun Choe, Satoshi Fujimoto, Shuji Tanaka, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper describes the fabrication process and mechanical prosperities of a novel probe card were described. To match the thermal expansion between the probe card and a silicon wafer in wafer-level burn-in test, a Pyrex glass substrate with feedthrough connections was used to support the probes. To make the slantwise probe contactors, spray coating was used to form a uniform photoresist film on a deeply-wet-etched silicon wafer. The fabricated probe card has 13185 p+ silicon probe contactors at a pitch of 150 μm on a area of 44.0 mm × 45.7 mm. The rigidity of the probes is approximately 91.45 N/m. The planarity of the probe tips is within ±1 μm from the base level.

Original languageEnglish
Title of host publicationTRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
Pages1259-1262
Number of pages4
Publication statusPublished - 2005 Nov 9
Event13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
Duration: 2005 Jun 52005 Jun 9

Publication series

NameDigest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Volume2

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
CountryKorea, Republic of
CitySeoul
Period05/6/505/6/9

Keywords

  • Probe card
  • Spray coating
  • Thermal expansion

ASJC Scopus subject areas

  • Engineering(all)

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