A highly reliable design for a nonmetallurgical contact-joint structure consisting of an adhesive film

Naotaka Tanaka, Kenya Kawano, Hideo Miura, Yoshiyuki Kado, Ikuo Yoshida

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)

Abstract

The interconnection reliability of a contact-joint structure with anisotropic conductive film (ACF) or non-conductive film (NCF) was evaluated in terms of stability of the compressive force at the contact face between a chip bump and a substrate pad. The key factor that dominates the interconnection reliability during temperature cycling is the amount of plastic strain in the chip bump (gold bump) at the contact face. The plastic deformation of the chip bump must therefore be controlled by selecting the appropriate mechanical properties of the adhesive film (ACF or NCF) and the build-up substrate material. Moreover, the interconnection reliability during moisture-resistance tests deteriorates because of stress relaxation near the glass-transition temperature of the commonly used build-up material. It is therefore concluded that a new material system, which includes the mechanical property of the build-up material for preventing stress relaxation, should be developed.

Original languageEnglish
Pages (from-to)82-86
Number of pages5
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume126
Issue number1
DOIs
Publication statusPublished - 2004 Mar 1
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'A highly reliable design for a nonmetallurgical contact-joint structure consisting of an adhesive film'. Together they form a unique fingerprint.

Cite this