A hierarchic bonding procedure for the assembly of micro confocal microscope

C. Jia, Joerg Eckhardt Froemel, M. Wiemer, T. Gessner, S. Bargiel, N. Passilly, M. Barański, C. Gorecki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The construction of optical micro systems imposes new challenges on assembly technologies. These include the handling of multiple heterogeneous substrates, low thermal budget for the establishment of bonding connections, the accurate alignment of the substrates during wafer stacking and the integration of special components such as discrete optical lenses. In order to address these problems, a hierarchic wafer/component bonding process is proposed for the assembly of a 3-axis confocal scanning microscope. Experiment results indicate that the 9 constitutive components of the microscope, which are made from materials with different thermal expansion coefficients, can be joined together at less than 400°C global temperature. The strength of the achieved bonding is comparable to standard anodic or fusion bonding and can withstand diverse back-end-of-line processes such as dicing or grinding. Besides, the hermeticity of the developed bonding process is validated by monitoring the static deformation of a leak-indicating membrane.

Original languageEnglish
Title of host publicationProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Pages187-189
Number of pages3
DOIs
Publication statusPublished - 2012 Aug 15
Event2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan
Duration: 2012 May 222012 May 23

Publication series

NameProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Other

Other2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
CountryJapan
CityTokyo
Period12/5/2212/5/23

Keywords

  • MOEMS
  • confocal microscope
  • heterogeneous system integration
  • microsystem technology
  • wafer bonding

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Vision and Pattern Recognition

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  • Cite this

    Jia, C., Froemel, J. E., Wiemer, M., Gessner, T., Bargiel, S., Passilly, N., Barański, M., & Gorecki, C. (2012). A hierarchic bonding procedure for the assembly of micro confocal microscope. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 (pp. 187-189). [6238087] (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238087