A fault model for conducted intentional electromagnetic interferences

Laurent Sauvage, Sylvain Guilley, Jean Luc Danger, Naofumi Homma, Yu-Ichi Hayashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Experimental setups used in electromagnetic compatibility tests can be used as platforms for fault injections. Faulting an equipment is a mean for a malevolent attacker to extract secret information. Compared to other fault injection setups, those based on EMC tests provide three advantages: non-invasivity, absence of synchronization, and frequency selectivity. This injection technique therefore allows the attacker to perform analysis with little knowledge of the targeted equipment. To assess the potential of this attack, a characterization of its effects is needed. This is the purpose of this paper. More precisely, our contributions are twofold: First of all, we observe that the faults are reproducible. Second, we show that the fault model is compatible with known attacks.

Original languageEnglish
Title of host publicationEMC 2012 - 2012 IEEE International Symposium on Electromagnetic Compatibility, Final Program
Pages788-793
Number of pages6
DOIs
Publication statusPublished - 2012 Dec 12
Event2012 IEEE International Symposium on Electromagnetic Compatibility, EMC 2012 - Pittsburgh, PA, United States
Duration: 2012 Aug 52012 Aug 10

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Other

Other2012 IEEE International Symposium on Electromagnetic Compatibility, EMC 2012
CountryUnited States
CityPittsburgh, PA
Period12/8/512/8/10

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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  • Cite this

    Sauvage, L., Guilley, S., Danger, J. L., Homma, N., & Hayashi, Y-I. (2012). A fault model for conducted intentional electromagnetic interferences. In EMC 2012 - 2012 IEEE International Symposium on Electromagnetic Compatibility, Final Program (pp. 788-793). [6351664] (IEEE International Symposium on Electromagnetic Compatibility). https://doi.org/10.1109/ISEMC.2012.6351664