A cavity chip interconnection technology for thick MEMS chip integration in MEMS-LSI multichip module

Kang Wook Lee, Soichiro Kanno, Kouji Kiyoyama, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

We develop a cavity chip interconnection technology for thick microelectromechanical systems (MEMS) chip integration. The cavity chip comprising Cu through-silicon via and Cu beam-lead wire was fabricated by micromachining processes. The cavity chip could easily connect a thick MEMS chip with a high step height of more than a few hundred micrometers without changing the circuit design of MEMS chip and complicated extra process. Fundamental characteristics are successfully obtained from a pressure-sensing MEMS chip of 360- μ m thickness, where the MEMS chip was connected to a Si substrate by the cavity chip without degrading brittle sensing elements. This interconnection technology would provide a good solution for thick MEMS chip integration with high flexibility.

Original languageEnglish
Article number5613133
Pages (from-to)1284-1291
Number of pages8
JournalJournal of Microelectromechanical Systems
Volume19
Issue number6
DOIs
Publication statusPublished - 2010 Dec 1

Keywords

  • Beam lead
  • cavity chip
  • heterogeneous integration
  • microelectromechanical systems (MEMS) large-scale integration (LSI) (MEMS-LSI) multichip module
  • sidewall interconnection
  • through-silicon via (TSV)

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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