A new bakable pneumatic silicon microvalve has been developed by micromachining for advanced semiconductor device fabrication. This microvalve is composed of an anodically bonded glass-silicon-glass structure and it is further bonded to a Kovar alloy block which has stainless steel tubes. The gas flow rate could be controlled from 0.5 sccm to 50 sccm at an inlet pressure of 0.26 kgf cm-2. This microvalve can be used in the temperature range from 25 to 120°C.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering