A 60-GHz band WPAN transmitter module integrated with a planar dipole antenna using organic substrates and 3-D SiP technology

Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper gives a review of an ultra-small and low-cost 60-GHz band front-end module integrated with a single element planar dipole antenna. For miniaturization and cost reduction, we apply 3-D system-in-package (SiP) technology and organic substrates. The planar dipole antenna is patterned on the top layer substrate in the module. Maximum actual gain of 6.0 dBi at 63GHz is measured even though single element simple structure antenna is used. Additionally, a structure of a high-gain 60-GHz band planar dipole antenna which is applicable to 60-GHz band 3-D SiP front-end modules is described. To achieve high gain, we extend a dielectric substrate to main-beam direction. Although lossy substrate is used for cost reduction, the antenna patterned on organic substrates has enough potential for being used as a low-cost and simple configuration antenna integrated with the module.

Original languageEnglish
Title of host publication2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 - Hanzhou, China
Duration: 2011 Dec 122011 Dec 14

Publication series

Name2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011

Other

Other2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
CountryChina
CityHanzhou
Period11/12/1211/12/14

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Yoshida, S., Tanifuji, S., Kameda, S., Suematsu, N., Takagi, T., & Tsubouchi, K. (2011). A 60-GHz band WPAN transmitter module integrated with a planar dipole antenna using organic substrates and 3-D SiP technology. In 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 [6213759] (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011). https://doi.org/10.1109/EDAPS.2011.6213759