A 60-GHz band planar dipole array antenna using 3-D sip structure in small wireless terminals for beamforming applications

Satoshi Yoshida, Yuya Suzuki, Tuan Thanh Ta, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi

Research output: Contribution to journalArticlepeer-review

23 Citations (Scopus)

Abstract

A 60-GHz band planar dipole array antenna structure in a small wireless terminal is proposed for wide coverage area beamforming applications. Several substrates are stacked vertically by using 3-D system-in-package (SiP) technology, and the element antenna is installed on the substrates. A planar dipole antenna is used as an element antenna because it has a wider bandwidth than conventional patch antennas, which are widely used in 60-GHz band beamforming applications. Conventional dipole array antennas have a 1-D structure, or a 2-D structure arranged in multilayered substrate, resulting in narrow beamforming coverage area. The proposed structure has a wide beamforming coverage area because of the wide antenna spacing around 0.5 \lambda 0. Design using numerical and 3-D electromagnetic field simulation indicate that a 4\,\times\,2 arrangement is a feasible structure for a small wireless terminal with wide coverage area. Measurement results show that the designed array antenna has a wide coverage area, covering 75\circ and 95\circ in the theta and phi directions, respectively, with gain exceeding 10 dBi. The proposed planar dipole array structure using 3-D SiP technology is feasible as a 60-GHz band 2-D beamforming antenna in small wireless terminals.

Original languageEnglish
Article number6497524
Pages (from-to)3502-3510
Number of pages9
JournalIEEE Transactions on Antennas and Propagation
Volume61
Issue number7
DOIs
Publication statusPublished - 2013 Jan 1

Keywords

  • 3-D system-in-package
  • 60 GHz
  • beamforming
  • millimeter-wave
  • packaging and interconnects
  • planar antenna

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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