A 60 GHz-band 3-dimensional system-in-package transmitter module with integrated antenna

Noriharu Suematsu, Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Tadashi Takagi, Kazuo Tsubouchi

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

A low cost, ultra small Radio Frequency (RF) transceiver module with integrated antenna is one of the key technologies for short range millimeter-wave wireless communication. This paper describes a 60 GHz-band transmitter module with integrated dipole antenna. The module consists of three pieces of low-cost organic resin substrate. These substrates are vertically stacked by employing Cu ball bonding 3-dimensional (3-D) system-in-package (SiP) technology and the MMIC's are mounted on each organic substrates by using Au-stud bump bonding (SBB) technique. The planer dipole antenna is fabricated on the top of the stacked organic substrate to avoid the influence of the grounding metal on the base substrate. At 63 GHz, maximum actual gain of 6.0 dBi is obtained for fabricated planar dipole antenna. The measured radiation patterns are agreed with the electro-magnetic (EM) simulated result, therefore the other RF portion of the 3-D front-end module, such as flip chip mounted IC's on the top surface of the module, does not affect the antenna characteristics. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using stacked organic substrates.

Original languageEnglish
Pages (from-to)1141-1146
Number of pages6
JournalIEICE Transactions on Electronics
VolumeE95-C
Issue number7
DOIs
Publication statusPublished - 2012 Jul

Keywords

  • Antenna integration
  • MMIC
  • Millimeter-wave
  • Module
  • RFIC
  • SiP
  • Stud bump

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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