A 1.7mm3 MEMS-on-CMOS tactile sensor using human-inspired autonomous common bus communication

M. Makihata, M. Muroyama, Y. Nakano, S. Tanaka, T. Nakayama, U. Yamaguchi, H. Yamada, Y. Nonomura, H. Funabashi, Y. Hata, M. Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

20 Citations (Scopus)

Abstract

A bus-connected tactile sensor system composed of MEMS-CMOS integrated force sensors was developed. A capacitance-to-digital convertor for force sensing, a data reduction processor and a serial bus communication controller are implemented by a laboratory-designed ASIC (Application Specific Integrated Circuit). These functions enable the tactile sensor to be connected with a serial bus cable, and to autonomously transmit sensing data using CSMA (Carrier Sense Multiple Access) protocol. By applying a novel MEMS-CMOS integration technology, the integrated tactile sensor can be directly mounted on a flexible printed circuit board. The chip size is 2.54mm × 2.54mm × 0.27mm, i.e. 1.7mm3, and there are 20 through-silicon interconnection using saw-diced lateral tapered grooves. The digital data from the completed tactile sensor contains 32 bit force sensing data, which corresponds to an external force linearly. Data reduction processing based on threshold operation and adaptation inspired by tactile receptors was carried out to overcome packet collision problem. Finally, the serial bus network was demonstrated using three sensors to evaluate the network performance.

Original languageEnglish
Title of host publication2013 Transducers and Eurosensors XXVII
Subtitle of host publicationThe 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Pages2729-2732
Number of pages4
DOIs
Publication statusPublished - 2013 Dec 1
Event2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 - Barcelona, Spain
Duration: 2013 Jun 162013 Jun 20

Publication series

Name2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Other

Other2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
CountrySpain
CityBarcelona
Period13/6/1613/6/20

Keywords

  • MEMS-CMOS integration
  • Tactile sensor
  • sensor network
  • wafer level packaging

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'A 1.7mm<sup>3</sup> MEMS-on-CMOS tactile sensor using human-inspired autonomous common bus communication'. Together they form a unique fingerprint.

Cite this