7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration

Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High-density interconnections are highly required for 3D IC such as FPGA and image sensor applications. Fine-pitch interconnects using conventional solder microbumps are still required. To meet this requirements, low-height Cu/Sn microbumps are evaluated in this study. The thermal compression bonding with the low-height solder microbumps makes it challenging to fulfill high-viscous capillary underfill (CUF) into extremely small gaps between the chips stacked in layers. Here, we demonstrate to apply a 7-μm-thick non-conductive film (NCF) to flip-chip bonding with the low-height solder microbumps. Compared with a CUF, the electrical characterization such as electromigration (EM) and leakage current of microbump daisy chains with the ultra-thin NCF was investigated with temperature cycle test (TCT) and unbiased HAST.

Original languageEnglish
Title of host publicationProceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1453-1458
Number of pages6
ISBN (Electronic)9781728161808
DOIs
Publication statusPublished - 2020 Jun
Event70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
Duration: 2020 Jun 32020 Jun 30

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2020-June
ISSN (Print)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
CountryUnited States
CityOrlando
Period20/6/320/6/30

Keywords

  • 3DIC
  • HAST
  • NCF
  • TCT
  • fine-pitch bonding
  • reliability
  • solder microbump

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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