60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates

Noriharu Suematsu, Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Tadashi Takagi, Kazuo Tsubouchi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

A low cost, ultra small antenna integrated wireless transceiver is one of the key technologies for short range millimeter-wave wireless communication. A RF module with integrated antenna will be presented. It consists of low cost organic multi-layer substrates and MMICs. The substrates are vertically stacked by employing Cu ball bonding 3-D system in package (SiP) technology and MMIC's are mounted on the organic substrates by using stud bump bonding (SBB) technique. The antenna performance with RF module will be presented. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using organic substrates.

Original languageEnglish
Title of host publicationEuropean Microwave Week 2011
Subtitle of host publication"Wave to the Future", EuMW 2011, Conference Proceedings - 41st European Microwave Conference, EuMC 2011
Pages551-554
Number of pages4
Publication statusPublished - 2011 Dec 1
Event14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011 - Manchester
Duration: 2011 Oct 10 → 2011 Oct 13

Other

Other14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011
CityManchester
Period11/10/10 → 11/10/13

Keywords

  • Antenna Integration
  • Millimeter-wave
  • MMIC
  • Module
  • RFIC
  • SiP
  • Stud bump

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Suematsu, N., Yoshida, S., Tanifuji, S., Kameda, S., Takagi, T., & Tsubouchi, K. (2011). 60GHz antenna integrated transmitter module using 3-D SiP technology and organic substrates. In European Microwave Week 2011: "Wave to the Future", EuMW 2011, Conference Proceedings - 41st European Microwave Conference, EuMC 2011 (pp. 551-554). [6101998]