Abstract
A low cost, ultra small antenna integrated wireless transceiver is one of the key technologies for short range millimeter-wave wireless communication. A RF module with integrated antenna will be presented. It consists of low cost organic multi-layer substrates and MMICs. The substrates are vertically stacked by employing Cu ball bonding 3-D system in package (SiP) technology and MMIC's are mounted on the organic substrates by using stud bump bonding (SBB) technique. The antenna performance with RF module will be presented. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using organic substrates.
| Original language | English |
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| Title of host publication | European Microwave Week 2011 |
| Subtitle of host publication | "Wave to the Future", EuMW 2011, Conference Proceedings - 41st European Microwave Conference, EuMC 2011 |
| Pages | 551-554 |
| Number of pages | 4 |
| Publication status | Published - 2011 Dec 1 |
| Event | 14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011 - Manchester Duration: 2011 Oct 10 → 2011 Oct 13 |
Other
| Other | 14th European Microwave Week 2011: "Wave to the Future", EuMW 2011 - 41st EuropeanMicrowave Conference, EuMC 2011 |
|---|---|
| City | Manchester |
| Period | 11/10/10 → 11/10/13 |
Keywords
- Antenna Integration
- Millimeter-wave
- MMIC
- Module
- RFIC
- SiP
- Stud bump
ASJC Scopus subject areas
- Electrical and Electronic Engineering