60-GHz-band transmission module for 3-dimensional system-in-package

Kohei Masuda, Futoshi Takeuchi, Yasuhiro Hamada, Kenichi Maruhashi, Hiroshi Oguma, Suguru Kameda, Hiroyuki Nakase, Tadashi Takagi, Kazuo Tsubouchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

We have proposed an ultra-small and low-cost wireless 3-dimentional system-in-package that includes 60-GHz-band radio frequency (RF) components. 60-GHz-band integrated circuits (ICs) of a 60-GHz-band transmission (TX) module were mounted onto an Any Laya Interstitial Via Hole (ALIVH) substrate using stud bump bonding (SBB) technology. A mixer using antiparallel diode pair, power amplifier and driver amplifier ICs were fabricated on GaAs substrates. The characteristics of the fabricated TX module in a package were measured. The measured convasion gain and output power at 1-dB gain compression point of the TX module using a single balance mixer were 13 dB and 12 dBm, respectively. The 3-dB bandwidth at lowa-side-band (LSB) output was found to be 3 GHz. The measured conversion gain and output power at 1-dB gain compression point of the TX module using a double balance mixer were 11 dB and 10.5 dBm, respectively. The 3-dB bandwidth at LSB output was found to be 3.6 GHz. The measurement results showed sufficient paformance for a 60-GHz-band TX module.

Original languageEnglish
Title of host publication2006 8th Electronics Packaging Technology Conference, EPTC
Pages90-95
Number of pages6
DOIs
Publication statusPublished - 2006 Dec 1
Event2006 8th Electronics Packaging Technology Conference, EPTC - , Singapore
Duration: 2006 Dec 62006 Dec 8

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2006 8th Electronics Packaging Technology Conference, EPTC
CountrySingapore
Period06/12/606/12/8

ASJC Scopus subject areas

  • Engineering(all)

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