We have proposed an ultra-small and low-cost wireless 3-dimentional system-in-package that includes 60-GHz-band radio frequency (RF) components. 60-GHz-band integrated circuits (ICs) of a 60-GHz-band transmission (TX) module were mounted onto an Any Laya Interstitial Via Hole (ALIVH) substrate using stud bump bonding (SBB) technology. A mixer using antiparallel diode pair, power amplifier and driver amplifier ICs were fabricated on GaAs substrates. The characteristics of the fabricated TX module in a package were measured. The measured convasion gain and output power at 1-dB gain compression point of the TX module using a single balance mixer were 13 dB and 12 dBm, respectively. The 3-dB bandwidth at lowa-side-band (LSB) output was found to be 3 GHz. The measured conversion gain and output power at 1-dB gain compression point of the TX module using a double balance mixer were 11 dB and 10.5 dBm, respectively. The 3-dB bandwidth at LSB output was found to be 3.6 GHz. The measurement results showed sufficient paformance for a 60-GHz-band TX module.