60-GHz band copper ball vertical interconnection for MMW 3-D system-in-Package Front-End Modules

Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

In order to realize millimeter-wave (MMW) 3-D system-in-package (SiP) front-end modules, we propose a 60-GHz band copper ball vertical interconnection structure, which interconnects between vertically stacked substrates. The structure enables ICs to be placed between the substrates. Since the diameter of the copper balls must exceed the thickness of the ICs, the distance between the substrates in the modules is larger than that of the flip-chip interconnection widely used in the MMW-band. Therefore, the conventional flip-chip interconnection does not scale for the interconnection between the substrates in MMW 3-D SiP front-end modules. The layout of grounded copper balls and the patterns of inner ground layers in the upper/lower substrates are designed using 3-D electromagnetic field simulation. The designed structure allows less than 1 dB transmission loss up to 71.1 GHz, compared with a through transmission line. The result is verified with fabrication and measurement and confirms the feasibility of MMW 3-D SiP front-end modules.

Original languageEnglish
Pages (from-to)1276-1284
Number of pages9
JournalIEICE Transactions on Electronics
VolumeE95-C
Issue number7
DOIs
Publication statusPublished - 2012 Jul

Keywords

  • 60-GHz band
  • Copper balls
  • Millimeter-wave
  • System-in-package
  • Vertical interconnection
  • WPAN

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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