500 nm-sized Ni-TSVwith aspect ratio 20 for future 3D-LSIs-A low-cost electroless-Ni plating approach

M. Murugesan, T. Fukushima, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science