3D memory chip stacking by multi-layer self-assembly technology

Takafumi Fukushima, Jichoru Be, M. Murugesan, H. Y. Son, M. S. Suh, K. Y. Byun, N. S. Kim, Kanuku Ri, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

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Engineering & Materials Science