@inproceedings{e31acf71990f43c4b5008282e938dbb9,
title = "3D memory chip stacking by multi-layer self-assembly technology",
abstract = "Multi-layer 3D chip stacking by a surface-tension-driven self-assembly technique is demonstrated. After multi-layer self-assembly, memory chips having Cu-SnAg μbump and Cu-TSVs are bonded on a substrate by thermal compression to confirm electrical joining between them. In addition, we investigate the impacts of wetting properties of chip/substrate surfaces, μbump shapes, and μbump layout on alignment accuracies of self-assembly. Good electrical characteristics are obtained from the TSV-μbump daisy chains in the stacked memory chips.",
keywords = "3D Chip Stack, Memory, Microbump, Self-Assembly, TSV",
author = "Takafumi Fukushima and Jichoru Be and M. Murugesan and Son, {H. Y.} and Suh, {M. S.} and Byun, {K. Y.} and Kim, {N. S.} and Kanuku Ri and Mitsumasa Koyanagi",
year = "2013",
month = dec,
day = "1",
doi = "10.1109/3DIC.2013.6702360",
language = "English",
isbn = "9781467364843",
series = "2013 IEEE International 3D Systems Integration Conference, 3DIC 2013",
booktitle = "2013 IEEE International 3D Systems Integration Conference, 3DIC 2013",
note = "2013 IEEE International 3D Systems Integration Conference, 3DIC 2013 ; Conference date: 02-10-2013 Through 04-10-2013",
}