3D integration technology for 3D stacked retinal chip

Y. Kaiho, Y. Ohara, H. Takeshita, K. Kiyoyama, Kanuku Ri, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

To recover visual sensation of blind patients, we have proposed a novel three dimensionally (3D) stacked retinal prosthesis chip in which several LSI chips such as consisting of photodetector, signal processing circuit and stimulus current generator are vertically stacked and electrically connected using 3D integration technology. In this work, we developed several key process for realizing 3D stacked retinal prosthesis chip. Fine sized Cu TSV of 10 μm width and 30 μm depth was successfully formed from the back side of the thinned prosthesis chip. The prosthesis chip with the back side Cu TSVs was flip-chip bonded to Si substrate/flexible substrate through Cu/Sn micro-bumps for evaluating the feasibility of 3D integration technology.

Original languageEnglish
Title of host publication2009 IEEE International Conference on 3D System Integration, 3DIC 2009
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE International Conference on 3D System Integration, 3DIC 2009 - San Francisco, CA, United States
Duration: 2009 Sep 282009 Sep 30

Publication series

Name2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Other

Other2009 IEEE International Conference on 3D System Integration, 3DIC 2009
CountryUnited States
CitySan Francisco, CA
Period09/9/2809/9/30

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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