3D integration technology and reliability

Engineering

• Contamination 75%
• Mechanical Stress 50%
• Technology Integration 50%
• Reliability 25%
• Silicon Substrate 25%
• Compressive Stress 25%
• Three-Dimensional (3d) 25%
• Reliability Issue 25%
• Minority Carrier 25%
• Wafer Bonding 25%
• Mechanical Strain 25%
• Back Surface 25%
• Integration 25%
• Thickness 25%
• High Density 25%
• Pitch 25%

Material Science

• Silicon 100%
• Metal 50%
• Capacitor 25%
• Crystal Defect 25%