TY - GEN
T1 - 3D-IC technology and reliability challenges
AU - Tanaka, Tetsu
PY - 2017/6/30
Y1 - 2017/6/30
N2 - Three-dimensional (3D) ICs using TSVs are the most promising candidate for high performance and low power computing since they have lots of advantages such as short wiring length, small chip size, and small pin capacitances, as shown in Fig. 1 [1]. Until now, several kinds of 3D-ICs including image sensor chip, shared memory, and retinal prosthesis chip have been fabricated successfully.
AB - Three-dimensional (3D) ICs using TSVs are the most promising candidate for high performance and low power computing since they have lots of advantages such as short wiring length, small chip size, and small pin capacitances, as shown in Fig. 1 [1]. Until now, several kinds of 3D-ICs including image sensor chip, shared memory, and retinal prosthesis chip have been fabricated successfully.
UR - http://www.scopus.com/inward/record.url?scp=85026789572&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85026789572&partnerID=8YFLogxK
U2 - 10.23919/IWJT.2017.7966513
DO - 10.23919/IWJT.2017.7966513
M3 - Conference contribution
AN - SCOPUS:85026789572
T3 - 17th International Workshop on Junction Technology, IWJT 2017
SP - 51
EP - 53
BT - 17th International Workshop on Junction Technology, IWJT 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th International Workshop on Junction Technology, IWJT 2017
Y2 - 1 June 2017 through 2 June 2017
ER -