3D-IC technology and reliability challenges

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Three-dimensional (3D) ICs using TSVs are the most promising candidate for high performance and low power computing since they have lots of advantages such as short wiring length, small chip size, and small pin capacitances, as shown in Fig. 1 [1]. Until now, several kinds of 3D-ICs including image sensor chip, shared memory, and retinal prosthesis chip have been fabricated successfully.

Original languageEnglish
Title of host publication17th International Workshop on Junction Technology, IWJT 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages51-53
Number of pages3
ISBN (Electronic)9784863486263
DOIs
Publication statusPublished - 2017 Jun 30
Event17th International Workshop on Junction Technology, IWJT 2017 - Kyoto, Japan
Duration: 2017 Jun 12017 Jun 2

Publication series

Name17th International Workshop on Junction Technology, IWJT 2017

Other

Other17th International Workshop on Junction Technology, IWJT 2017
CountryJapan
CityKyoto
Period17/6/117/6/2

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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