3D IC Integration Since 2008

Philip Garrou; Peter Ramm; Mitsumasa Koyanagi

doi:10.1002/9783527670109.ch01

3D IC Integration Since 2008

Philip Garrou, Peter Ramm, Mitsumasa Koyanagi

New Industry Creation Hatchery Center (NICHe)

Research output: Chapter in Book/Report/Conference proceeding › Chapter

5 Citations (Scopus)

Original language	English
Title of host publication	3D Process Technology
Publisher	Wiley-Blackwell
Pages	1-12
Number of pages	12
Volume	3
ISBN (Electronic)	9783527670109
ISBN (Print)	9783527334667
DOIs	https://doi.org/10.1002/9783527670109.ch01
Publication status	Published - 2014 Jul 21

Keywords

3D IC integration
3D applications
Amkor
CoWoS
GlobalFoundries
Hynix
Interposer
Memory cube
Micron
SPIL
Samsung
TSMC
Through-silicon via

ASJC Scopus subject areas

Engineering(all)
Biochemistry, Genetics and Molecular Biology(all)
Chemical Engineering(all)
Materials Science(all)

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10.1002/9783527670109.ch01

Cite this

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title = "3D IC Integration Since 2008",

keywords = "3D IC integration, 3D applications, Amkor, CoWoS, GlobalFoundries, Hynix, Interposer, Memory cube, Micron, SPIL, Samsung, TSMC, Through-silicon via",

author = "Philip Garrou and Peter Ramm and Mitsumasa Koyanagi",

year = "2014",

month = jul,

day = "21",

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language = "English",

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T1 - 3D IC Integration Since 2008

AU - Garrou, Philip

AU - Ramm, Peter

AU - Koyanagi, Mitsumasa

PY - 2014/7/21

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KW - 3D IC integration

KW - 3D applications

KW - Amkor

KW - CoWoS

KW - GlobalFoundries

KW - Hynix

KW - Interposer

KW - Memory cube

KW - Micron

KW - SPIL

KW - Samsung

KW - TSMC

KW - Through-silicon via

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VL - 3

SP - 1

EP - 12

BT - 3D Process Technology

PB - Wiley-Blackwell

ER -

3D IC Integration Since 2008

Keywords

ASJC Scopus subject areas

Access to Document

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