3D IC Integration Since 2008

Philip Garrou, Peter Ramm, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingChapter

5 Citations (Scopus)
Original languageEnglish
Title of host publication3D Process Technology
PublisherWiley-Blackwell
Pages1-12
Number of pages12
Volume3
ISBN (Electronic)9783527670109
ISBN (Print)9783527334667
DOIs
Publication statusPublished - 2014 Jul 21

Keywords

  • 3D IC integration
  • 3D applications
  • Amkor
  • CoWoS
  • GlobalFoundries
  • Hynix
  • Interposer
  • Memory cube
  • Micron
  • SPIL
  • Samsung
  • TSMC
  • Through-silicon via

ASJC Scopus subject areas

  • Engineering(all)
  • Biochemistry, Genetics and Molecular Biology(all)
  • Chemical Engineering(all)
  • Materials Science(all)

Cite this

Garrou, P., Ramm, P., & Koyanagi, M. (2014). 3D IC Integration Since 2008. In 3D Process Technology (Vol. 3, pp. 1-12). Wiley-Blackwell. https://doi.org/10.1002/9783527670109.ch01