@inbook{a53c7726991e475aa90f3d981debd4b6,
title = "3D IC Integration Since 2008",
keywords = "3D IC integration, 3D applications, Amkor, CoWoS, GlobalFoundries, Hynix, Interposer, Memory cube, Micron, SPIL, Samsung, TSMC, Through-silicon via",
author = "Philip Garrou and Peter Ramm and Mitsumasa Koyanagi",
year = "2014",
month = jul,
day = "21",
doi = "10.1002/9783527670109.ch01",
language = "English",
isbn = "9783527334667",
volume = "3",
pages = "1--12",
booktitle = "3D Process Technology",
publisher = "Wiley-Blackwell",
address = "United States",
}