3D hybrid integration technology for opto-electronic hetero-integrated systems

Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We developed a 3D hybrid integration technology of complementary metal oxide semiconductor (CMOS), micro electro mechanical systems (MEMS) and photonic circuits for opto-electronic hetero-integrated systems. The 3D opto-electronic multi-chip module comprising CMOS, MEMS, and photonic devices was fabricated by using 3D hybrid integration technology. The electrical chips of amplitude shift keying (ASK) LSI, LC filter and pressure-sensing MEMS were mounted on the electrical Si interposer with Cu through silicon vias (TSVs). The photonic chips of vertical-cavity surface-emitting laser (VCSEL) and photodiode (PD) were embedded into the optical Si interposer with an optical waveguide. The electrical and the optical interposers were precisely bonded together to form 3D opto-electronic multi-chip module. The photonics and electrical devices are communicated via Cu TSVs. The photonic devices were connected via an optical waveguide. Basic functions of CMOS, MEMS and photonic devices in the 3D opto-electronic multi-chip module were successfully evaluated.

Original languageEnglish
Title of host publicationProcessing, Materials, and Integration of Damascene and 3D Interconnects
Pages71-90
Number of pages20
Edition12
DOIs
Publication statusPublished - 2010 Dec 1
EventProcessing, Materials, and Integration of Damascene and 3D Interconnects - 218th ECS Meeting - Las Vegas, NV, United States
Duration: 2010 Oct 102010 Oct 15

Publication series

NameECS Transactions
Number12
Volume33
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

OtherProcessing, Materials, and Integration of Damascene and 3D Interconnects - 218th ECS Meeting
CountryUnited States
CityLas Vegas, NV
Period10/10/1010/10/15

ASJC Scopus subject areas

  • Engineering(all)

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