3D hetero-integration technology with backside TSV and reliability challenges

Kanuku Ri, M. Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2013
PublisherIEEE Computer Society
ISBN (Print)9781479913602
DOIs
Publication statusPublished - 2013 Jan 1
Event2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2013 - Monterey, CA, United States
Duration: 2013 Oct 72013 Oct 10

Publication series

Name2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2013

Other

Other2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2013
CountryUnited States
CityMonterey, CA
Period13/10/713/10/10

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Ri, K., Murugesan, M., Fukushima, T., Tanaka, T., & Koyanagi, M. (2013). 3D hetero-integration technology with backside TSV and reliability challenges. In 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2013 [6716516] (2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2013). IEEE Computer Society. https://doi.org/10.1109/S3S.2013.6716516