TY - GEN
T1 - 3D electrodes integrated in a dynamic micro array for liposome electrofusion
AU - Sugahara, Keisuke
AU - Yoshida, Shotaro
AU - Takeuchi, Shoji
PY - 2018/4/24
Y1 - 2018/4/24
N2 - This paper describes a microfluidic device that enables pairing and fusion of liposomes. Our device has a dynamic micro array system for pairing liposomes and three-dimensional electrodes for applying voltage for fusing liposomes. We fabricated the dynamic micro array device by standard soft lithography method and integrated three-dimensional (3D) electrode into the device by injecting low melting point alloy. We successfully paired two liposomes in the dynamic micro array device and fused liposomes by the 3D integrated electrode. We believe that this dynamic micro array device will be useful in vesicle fusion and artificial cell studies.
AB - This paper describes a microfluidic device that enables pairing and fusion of liposomes. Our device has a dynamic micro array system for pairing liposomes and three-dimensional electrodes for applying voltage for fusing liposomes. We fabricated the dynamic micro array device by standard soft lithography method and integrated three-dimensional (3D) electrode into the device by injecting low melting point alloy. We successfully paired two liposomes in the dynamic micro array device and fused liposomes by the 3D integrated electrode. We believe that this dynamic micro array device will be useful in vesicle fusion and artificial cell studies.
UR - http://www.scopus.com/inward/record.url?scp=85047007967&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85047007967&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2018.8346764
DO - 10.1109/MEMSYS.2018.8346764
M3 - Conference contribution
AN - SCOPUS:85047007967
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1146
EP - 1149
BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
Y2 - 21 January 2018 through 25 January 2018
ER -