300 μm Deep through silicon via in laser-ablated CMOS multi-project wafer for cost-effective development of integrated MEMS

Yukio Suzuki, Hideyuki Fukushi, Masanori Muroyama, Yoshiyuki Hata, Takahiro Nakayama, Rakesh Chand, Hideki Hirano, Yutaka Nonomura, Hirofumi Funabashi, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

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