3-D micro-optical lens scanner made by multi-wafer bonding technology

S. Bargiel, C. Gorecki, M. Barański, N. Passilly, M. Wiemer, C. Jia, J. Frömel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)


We present the preliminary design, construction and technology of a microoptical, millimeter-size 3-D microlens scanner, which is a key-component for a number of optical on-chip microscopes with emphasis on the architecture of confocal microscope. The construction of the device relies on the vertical integration of micromachined building blocks: top glass lid, silicon electrostatic comb-drive X-Y and Z microactuators with integrated scanning microlenses, ceramic LTCC spacer, and bottom lid with focusing microlens. All components are connected on the wafer level only by sequential anodic bonding. The technology of through wafer vias is applied to create electrical connections through a stack of wafers. More generally, the presented bonding/connection technologies are also of a great importance for the development of various silicon-based devices based on vertical integration scheme. This approach offers a space-effective integration of complex MOEMS devices and an effective integration of various heterogeneous technologies.

Original languageEnglish
Title of host publicationMOEMS and Miniaturized Systems XII
Publication statusPublished - 2013
Externally publishedYes
EventMOEMS and Miniaturized Systems XII - San Francisco, CA, United States
Duration: 2013 Feb 42013 Feb 6

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


OtherMOEMS and Miniaturized Systems XII
Country/TerritoryUnited States
CitySan Francisco, CA


  • 3-D scanning
  • Microlens Scanner
  • Microlens integration
  • Microoptics
  • Multi-wafer Bonding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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