3-Axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding

Sho Asano, Masanori Muroyama, Travis Bartley, Takahiro Nakayama, Ui Yamaguchi, Hitoshi Yamada, Yoshiyuki Hata, Yutaka Nonomura, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

This paper reports a 3-axis MEMS-CMOS integrated tactile sensor for surface-mounting on a flexible bus line. This 3-axis sensor uses a bran-new CMOS LSI with capacitive sensing circuit and other extended functionalities (e.g. configurability and a robust clock data recovery algorithm). The sensor is composed of a flip-bonded CMOS substrate with a sensing diaphragm and a special low temperature co-fired ceramics (LTCC) substrate with vias. These substrates are electrically and mechanically connected by Au-Au bonding, forming sealed differential capacitive gaps. The completed sensor outputs coded 3-axis digital signals according to applied 3-axis force with small cross-sensitivity and hysteresis.

Original languageEnglish
Title of host publicationMEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages850-853
Number of pages4
ISBN (Electronic)9781509019731
DOIs
Publication statusPublished - 2016 Feb 26
Event29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China
Duration: 2016 Jan 242016 Jan 28

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2016-February
ISSN (Print)1084-6999

Other

Other29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Country/TerritoryChina
CityShanghai
Period16/1/2416/1/28

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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