250°C wafer-level vacuum sealing using electroplated copper bonding frame planarized by fly-cutting

Muhammad Salman Al Farisi, Koki Tanaka, Hideki Hirano, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This article reports a wafer-level heterogeneous integration and vacuum packaging technology by thermocompression bonding using electroplated Cu sealing frame planarized by single-point diamond fly-cutting. A high grain boundary density on the Cu surface induced by mechanical stress application during fly-cutting process enables vacuum sealing with bonding temperature as low as 250°C. At such low bonding temperature, a less amount of gases is desorbed, resulting in a sealed cavity pressure lower than 100 Pa. Furthermore, the shear strength higher than 150 MPa using 50 μm width sealing frames is also achieved. The availability of the proposed technology as an integration platform for wafers with several μm structure is also demonstrated.

Original languageEnglish
Title of host publicationTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1191-1194
Number of pages4
ISBN (Electronic)9781538627310
DOIs
Publication statusPublished - 2017 Jul 26
Event19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan, Province of China
Duration: 2017 Jun 182017 Jun 22

Publication series

NameTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
CountryTaiwan, Province of China
CityKaohsiung
Period17/6/1817/6/22

Keywords

  • Cu-Cu thermo-compression bonding
  • Electron backscatter diffraction
  • Heterogeneous integration
  • Single-point diamond fly-cutting
  • Thermal desorption spectroscopy
  • Wafer-level vacuum sealing
  • Zero-balance method

ASJC Scopus subject areas

  • Chemical Health and Safety
  • Instrumentation
  • Electrical and Electronic Engineering

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