2.45 GHZ saw-based passive binary transponder for wireless interfaces of integrated sensors

Jan H. Kuypers, Shuji Tanaka, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes the development of a MEMS tunable surface acoustic wave (SAW) device that allows an integrated sensor to be interrogated wirelessly in a range of several meters. The component itself requires no power for the wireless communication, as the principle is based on evaluating the reflected signal similar to a radar echo. The structure is similar to a one port reflective SAW delay line device. A MEMS switch is used to modulate the SAW according to the binary sensor output. The encoding solely requires an electrostatic tuning voltage of as low as 3 V for the MEMS switch. We successfully demonstrated that the device assembled on a microstrip antenna wirelessly transmitted ASCII characters over a distance of up to 2 m.

Original languageEnglish
Title of host publicationMEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
Pages1040-1043
Number of pages4
DOIs
Publication statusPublished - 2008 Aug 29
Event21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson - Tucson, AZ, United States
Duration: 2008 Jan 132008 Jan 17

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
CountryUnited States
CityTucson, AZ
Period08/1/1308/1/17

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Kuypers, J. H., Tanaka, S., & Esashi, M. (2008). 2.45 GHZ saw-based passive binary transponder for wireless interfaces of integrated sensors. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems (pp. 1040-1043). [4443837] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2008.4443837