20 Milliwatt class ultralow power integrated OCXO using polyimide and thin film metal connection suspended in vacuum packaging

Takanori Suzuki; Masanori Muroyama; Tomoyuki Taira; Noritoshi Kimura; Takashiro Tsukamoto; Shuji Tanaka

doi:10.1109/TRANSDUCERS.2017.7994080

20 Milliwatt class ultralow power integrated OCXO using polyimide and thin film metal connection suspended in vacuum packaging

Takanori Suzuki, Masanori Muroyama, Tomoyuki Taira, Noritoshi Kimura, Takashiro Tsukamoto, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper proposes a 20 mW class low-power and miniaturized oven controlled crystal oscillator (OCXO) by combination of the following two methods. (1) A crystal resonator and a CMOS-LSI for oscillation and oven control circuits are integrated for realizing an integrated OCXO chip. (2) The integrated chip is connected with thin film metal interconnection on a thin polyimide film and is suspended by an ultrasonic bonding technique in vacuum packaging. Based on the thermal analysis, we designed the thermally isolated connection. Experimental results showed that the fabricated OCXO successfully saved about 90% power consumption compared with the existing wire bonding implementation.

Original language	English
Title of host publication	TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	435-438
Number of pages	4
ISBN (Electronic)	9781538627310
DOIs	https://doi.org/10.1109/TRANSDUCERS.2017.7994080
Publication status	Published - 2017 Jul 26
Event	19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan, Province of China Duration: 2017 Jun 18 → 2017 Jun 22

Publication series

Name	TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other	19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
Country	Taiwan, Province of China
City	Kaohsiung
Period	17/6/18 → 17/6/22

Keywords

Low-power consumption
MEMS-CMOS integration
OCXO
Packaging technology
Thermal isolation structure
Thin film connection

ASJC Scopus subject areas

Chemical Health and Safety
Instrumentation
Electrical and Electronic Engineering

Access to Document

10.1109/TRANSDUCERS.2017.7994080

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Suzuki, T., Muroyama, M., Taira, T., Kimura, N., Tsukamoto, T., & Tanaka, S. (2017). 20 Milliwatt class ultralow power integrated OCXO using polyimide and thin film metal connection suspended in vacuum packaging. In TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 435-438). [7994080] (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2017.7994080

20 Milliwatt class ultralow power integrated OCXO using polyimide and thin film metal connection suspended in vacuum packaging. / Suzuki, Takanori; Muroyama, Masanori; Taira, Tomoyuki; Kimura, Noritoshi; Tsukamoto, Takashiro ; Tanaka, Shuji.

TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., 2017. p. 435-438 7994080 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Suzuki, T, Muroyama, M, Taira, T, Kimura, N, Tsukamoto, T & Tanaka, S 2017, 20 Milliwatt class ultralow power integrated OCXO using polyimide and thin film metal connection suspended in vacuum packaging. in TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems., 7994080, TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, Institute of Electrical and Electronics Engineers Inc., pp. 435-438, 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, Kaohsiung, Taiwan, Province of China, 17/6/18. https://doi.org/10.1109/TRANSDUCERS.2017.7994080

Suzuki T, Muroyama M, Taira T, Kimura N, Tsukamoto T , Tanaka S. 20 Milliwatt class ultralow power integrated OCXO using polyimide and thin film metal connection suspended in vacuum packaging. In TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc. 2017. p. 435-438. 7994080. (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/TRANSDUCERS.2017.7994080

Suzuki, Takanori ; Muroyama, Masanori ; Taira, Tomoyuki ; Kimura, Noritoshi ; Tsukamoto, Takashiro ; Tanaka, Shuji. / 20 Milliwatt class ultralow power integrated OCXO using polyimide and thin film metal connection suspended in vacuum packaging. TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 435-438 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

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abstract = "This paper proposes a 20 mW class low-power and miniaturized oven controlled crystal oscillator (OCXO) by combination of the following two methods. (1) A crystal resonator and a CMOS-LSI for oscillation and oven control circuits are integrated for realizing an integrated OCXO chip. (2) The integrated chip is connected with thin film metal interconnection on a thin polyimide film and is suspended by an ultrasonic bonding technique in vacuum packaging. Based on the thermal analysis, we designed the thermally isolated connection. Experimental results showed that the fabricated OCXO successfully saved about 90% power consumption compared with the existing wire bonding implementation.",

keywords = "Low-power consumption, MEMS-CMOS integration, OCXO, Packaging technology, Thermal isolation structure, Thin film connection",

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AU - Tsukamoto, Takashiro

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N2 - This paper proposes a 20 mW class low-power and miniaturized oven controlled crystal oscillator (OCXO) by combination of the following two methods. (1) A crystal resonator and a CMOS-LSI for oscillation and oven control circuits are integrated for realizing an integrated OCXO chip. (2) The integrated chip is connected with thin film metal interconnection on a thin polyimide film and is suspended by an ultrasonic bonding technique in vacuum packaging. Based on the thermal analysis, we designed the thermally isolated connection. Experimental results showed that the fabricated OCXO successfully saved about 90% power consumption compared with the existing wire bonding implementation.

AB - This paper proposes a 20 mW class low-power and miniaturized oven controlled crystal oscillator (OCXO) by combination of the following two methods. (1) A crystal resonator and a CMOS-LSI for oscillation and oven control circuits are integrated for realizing an integrated OCXO chip. (2) The integrated chip is connected with thin film metal interconnection on a thin polyimide film and is suspended by an ultrasonic bonding technique in vacuum packaging. Based on the thermal analysis, we designed the thermally isolated connection. Experimental results showed that the fabricated OCXO successfully saved about 90% power consumption compared with the existing wire bonding implementation.

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