20 Milliwatt class ultralow power integrated OCXO using polyimide and thin film metal connection suspended in vacuum packaging

Takanori Suzuki, Masanori Muroyama, Tomoyuki Taira, Noritoshi Kimura, Takashiro Tsukamoto, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper proposes a 20 mW class low-power and miniaturized oven controlled crystal oscillator (OCXO) by combination of the following two methods. (1) A crystal resonator and a CMOS-LSI for oscillation and oven control circuits are integrated for realizing an integrated OCXO chip. (2) The integrated chip is connected with thin film metal interconnection on a thin polyimide film and is suspended by an ultrasonic bonding technique in vacuum packaging. Based on the thermal analysis, we designed the thermally isolated connection. Experimental results showed that the fabricated OCXO successfully saved about 90% power consumption compared with the existing wire bonding implementation.

Original languageEnglish
Title of host publicationTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages435-438
Number of pages4
ISBN (Electronic)9781538627310
DOIs
Publication statusPublished - 2017 Jul 26
Event19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan, Province of China
Duration: 2017 Jun 182017 Jun 22

Publication series

NameTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
CountryTaiwan, Province of China
CityKaohsiung
Period17/6/1817/6/22

Keywords

  • Low-power consumption
  • MEMS-CMOS integration
  • OCXO
  • Packaging technology
  • Thermal isolation structure
  • Thin film connection

ASJC Scopus subject areas

  • Chemical Health and Safety
  • Instrumentation
  • Electrical and Electronic Engineering

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