10 μm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kanuku Ri, Mariappan Murugesan, Jichoru Be, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

45 Citations (Scopus)

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Engineering & Materials Science