10 μm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kanuku Ri, Mariappan Murugesan, Jichoru Be, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

43 Citations (Scopus)

Abstract

We develop novel micro-bumping technology to realize small size, fine pitch and uniform height Cu/Sn bumps. Electroplated -evaporation bumping (EEB) technology, which is a combination of Cu electroplating and Sn evaporation, is developed to achieve uniform height of Cu/Sn bumps. We develop CMOS compatible dry etching processes for removing sputtered Cu/Ta layers to achieve small size and fine pitch Cu/Sn bump. 5 μm square and 10 μm pitch Cu/Sn micro-bumps are successfully fabricated for the first time. Bump height variation is 5 μm ±3 % (95%, 2σ), which is uniform compared to electroplated Cu/Sn bumps. We evaluate micro-joining characteristics of Cu/Sn micro-bumps. Good I-V characteristics are measured from the daisy chain consisting of 1500 bumps with 10 μm square and 20 μm pitch. Resistance of Cu/Sn bump is 35 mω/bump, which is very low value compared to electroplated Cu/Sn bumps.

Original languageEnglish
Title of host publication2009 IEEE International Conference on 3D System Integration, 3DIC 2009
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE International Conference on 3D System Integration, 3DIC 2009 - San Francisco, CA, United States
Duration: 2009 Sep 282009 Sep 30

Publication series

Name2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Other

Other2009 IEEE International Conference on 3D System Integration, 3DIC 2009
CountryUnited States
CitySan Francisco, CA
Period09/9/2809/9/30

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Ohara, Y., Noriki, A., Sakuma, K., Ri, K., Murugesan, M., Be, J., Yamada, F., Fukushima, T., Tanaka, T., & Koyanagi, M. (2009). 10 μm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. In 2009 IEEE International Conference on 3D System Integration, 3DIC 2009 [5306532] (2009 IEEE International Conference on 3D System Integration, 3DIC 2009). https://doi.org/10.1109/3DIC.2009.5306532